From: Dag Spicer <>
Date: Mon, 11 Jan 1999 09:34:38 -0800
Subject: Re: PC IF: Connectors

Hi Dave,
You may with to contact Dimitri Grabbe, VP and Head of R&D at AMP
who is a legend in the industry. He has the largest collection of
connectors and connector systems/technologies in the world
(and >350 patents!!).He works at their Harrisburg plant--sorry I
don't have the tel... but please say hi if you manage to reach him...
--------------------random comment from the web, but appropriate-----

Dimitry Grabbe
Dimitry Grabbe, 83, of Lower Swatara Twp., died Wednesday, March 2, 2011 in MS HersheyMedical Center. He was the retired Director of Research and Technology for AMP, Inc. and a member of St. Nicholas Serbian Eastern Orthodox Church, Oberlin. Dimitry may have been the most remarkable person who I ever met. He is survived by his loving wife of 60 years, Xenia von Luchtenberg, their seven children and their spouses, fourteen grandchildren and a sister.

In December of 2007 an interview was conducted with Mr. Grabbe for the IEEE.

Dimitry Grabbe played an integral part in advancing U.S. space exploration. His pioneering work has produced nearly 500 U.S. and foreign patents covering machine design, semiconductor packaging,electronics assembly and optoelectronic connector design. His work in printed circuit board technology for electronic packaging led to the development of large, multi-layer printed circuit boards. This proved crucial in helping U.S. astronauts gain greater real-time control of their space-exploration activities.

In 1964, Mr. Grabbe founded the Maine Research Corporation which specialized in high-end printed circuit boards; the company was dissolved in 1972. He joined AMP, Inc. in 1973, and helped it become a world leader in electrical/electronic connector technology, test socket technology and miniature semiconductor packages. Today, Mr. Grabbe is assisting Dr. Pryputniewicz, professor of mechanical engineering and founding director of the center for holographic studies and laser micro-mechaTronics (CHSLT) at Worcester Polytechnic Institute (WPI) in Worcester, Mass. with research on gyroscopes and accelorometers.

An IEEE Life Fellow, Mr. Grabbe has also been recognized by AMP (now part of Tyco Electronics) with a Lifetime Achievement Award, and by the American Society of Mechnical Engineers, which chose him for its Leonardo da Vinci Award. (IEEE Statement

Dimitry Grabbe


2007 IEEE CPMT - Components, Packaging & Manufacturing Technology Award
“For contributions to the fields of electrical/electronic connector technology, and development of multi-layer printed wiring boards”
Dimitry Grabbe, Worcester Polytechnic Institute, Worcester, MA, USA

2006 IEEE CPMT Fellow - The Fellow Level recognition is among the highest honor in the package engineering profession.

Dimitry Grabbe

1999 IEEE CPMT - Electronics Manufacturing Technology Award
Dimitry Grabbe  $1,000 + Certificate

1992 IEEE Fellow Award

For original work on the design, analysis, and development of electronic packaging
Dimitry G. Grabbe

1989 ASME - ASME Leonardo da Vinci Award
This award is bestowed for eminent achievement in the design or invention of a product which is universally recognized as an important advance in machine design.
Dimitry G. Grabbe

1988 Hall of Fame for Engineering, Science and Technology

Dimitry G. Grabbe

1986 IMAPS - International Microelectronics and Packaging Society - William D. Ashman Award
Dimitry G. Grabbe

About the IEEE CPMT - Components, Packaging & Manufacturing Technology Award: Its Purpose:To recognize major contributions to Electronic Manufacturing Technology in fields encompassed by the CPMT Society. Basis for judging: Contributions may include technical development of, or management (directing) of major new electronic manufacturing processes; significantly increasing yield and/or reliability of established manufacturing processes, etc. Work in the management of CPMT conferences or its BoG may be contributory but not sufficient to receive the award.


The Grabbe Collection the collection will have a new home at historic Camp Evans under the sponsorship of the IEEE History Center, InfoAge, and Prismark Partners. The IEEE History Center is maintained by Rutgers University.

The Grabbe Computer Component Collection spans 50 years of computer packaging development.  It is the result of the dedicated selection, photographing, and organizing of components which step by step show important steps in the progress of computer development.  The collection has selected components from nearly every major manufacture and represents a cross section of the computer industry.  The unique collection has 7000 components and 45,000 custom slides.  Many of the slides are microscopic views of circuits which look more like art than technology and represent thousands of hours of work by Mr. Grabbe.

It is very exciting for InfoAge to house Mr. Grabbe's excellent collection where thousands of persons will be able to see computer development from ENIAC to current technology.  It is alsovery fitting for Camp Evans to display this collection with its Marconi history, World War II electronic and vacuum tube research history and especially Camp Evans contributions to early transistor development and application to military system.

We at InfoAge thank Dr. Michael Gelselowitz and staff of the IEEE History Center and Mr. Charles Lassen and staff of Prismark Partners LLC for their help and sponsorship in keeping this excellent collect intact and creating the possiblity of expanding the collection in the future. We are very greatful to Mr. Dimitry Grabbe for the thousands of hours and expertise he invested of his life in creating this important collection over his professional career.  Many persons in the future will have a much better understanding of the creativity and the challenges met in computer  packaging technology over the last 50 years thanks to Mr. Grabbe's efforts. Some stdents may even consider the many professional careers in this area and the many manufactures represented in this collection as excellent employers.

The Grabbe collection contains components from the below manufactures:   3M   AC Spark Plug   ACRI   Amdahl   AMI   AMP   AMP-MECA   NASA (APOLLO SPACE CRAFT)  AST   AT&T   UGAT   Bell Labs   Bell Northern Research   Bourns   Bowmar   Burroughs   CBS   CDC   Chrysler   CITIZEN   COB   Concurrent Logic   Cray   CSR   Cyrix    DALLAS-SEMI   DEC   DELCO   DGY   DIRECT BOND   Dow Corning   DuPont   ELCO   ENIAC   Fairchild   Ford   FRISC Inc.   Fujitsu   Fujitsu-opt   FUSION   G.E.   General Dynamics   Gigabit   HDD   Hitachi   Honeywell   HP   Hughes   IBM Japan   IBM Owego   IBM   ILLIAC   INMOS   Intel lux   NTEL   Interposer   Intersil   ITT   JPL   LGA   Litel   LSI LOGIC   MA-CON   Maine Research   MCC   Methode   Micro SMT   MICRON   MIT   Mitsubishi   MMKOR   MMS   MOSAIC   MOSTEC   Motorola. Optop AG   Motorola   National   NCHIP   NCR   NEC   Nixdorf   Northup   OKI   Olin Pacific Micro   Panasonic   PGA   Phillips   Picowire   PMI   PMP   Raychem   Raytheon   RCA   Read-Rite   Relays   Rockwell   Rogers   SGS-Thomsom   SHARP   Shindo   Shinko   Siemens   Signetics   SIM   Sintra   SMT   Sperry   Switch   Tektronix   Teledyne   Tessera   Texas Instruments   Thomas+betts   Timex   Toshiba   Trident   Trilogy  TRW   Unisys   Univac   Universal   USSR-Comp.  UTC Vitesse   VLSI   Western Digital  Westinghouse   WETTEK   XEROX.

Partial list of  Grabbe US Patents
1 6,264,476 Wire segment based interposer for high frequency electrical connection
2 6,213,753 Mold apparatus
3 6,146,438 Ball formation method
4 6,080,020 Ground plane for a filtered electrical connector
5 6,077,474 Ball formation apparatus
6 6,039,583 Configurable ground plane
7 6,012,225 Method of making surface mount pads
8 5,969,330 Smart card reader with hinged cover and cover actuating surface
9 5,936,222 Smart card reader having pivoting contacts
10 5,927,140 Tool accelerator
11 5,868,019 Feed system in a stamping and forming machine having a quick release
12 5,863,449 Method for forming optical interferometer
13 5,816,482 Method and apparatus for attaching balls to a substrate
14 5,813,871 High frequency electrical connector
15 5,759,048 Board to board connector
16 5,718,145 Machine for performing high speed stamping and forming operations
17 5,700,151 Adjustable height sealed electrical connector
18 5,694,804 Stamping and forming machine having high speed toggle actuated ram
19 5,669,774 Ball grid array socket
20 5,667,393 Printed circuit board electrical connector with sealed housing cavity
21 5,653,598 Electrical contact with reduced self-inductance
22 5,637,919 Perimeter independent precision locating member
23 5,606,888 Method of forming relatively hard materials
24 5,575,661 Flexible film with circuitry thereon having improved local compliance and force distribution
25 5,573,435 Tandem loop contact for an electrical connector
26 5,505,626 Electrical connector with tension adjusting means
27 5,432,679 Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane
28 5,384,954 Method of manufacture of a contact guide
29 5,383,095 Circuit board and edge-mountable connector therefore, and method of preparing a circuit board edge
30 5,380,221 Anchor pin
31 5,380,210 High density area array modular connector
32 5,342,206 Socket for direct electrical connection to an integrated circuit chip
33 5,320,541 Electrical connector having terminals which cooperate with the edge of a circuit board
34 5,295,841 Supportable contact and chip carrier socket for use with an assembly/disassembly tool
35 5,252,079 Method of manufacture of a contact guide
36 5,243,757 Method of making contact surface for contact element
37 5,228,861 High density electrical connector system
38 5,217,728 High density mold
39 5,201,664 Alignment member for use with surface mount contacts
40 5,199,885 Electrical connector having terminals which cooperate with an edge of a circuit board
41 5,192,215 Electrical socket for leaded chip carriers
42 5,175,928 Method of manufacturing an electrical connection assembly
43 5,173,055 Area array connector
44 5,158,467 High speed bare chip test socket
45 5,152,695 Surface mount electrical connector
46 5,151,046 Electrical terminal which has overstress protection
47 5,147,214 Electrical terminal which has overstress protection
48 5,131,852 Electrical socket
49 5,127,839 Electrical connector having reliable terminals
50 5,116,458 Electrical edge contact member and a method of manufacturing same
51 5,104,324 Multichip module connector
52 5,073,118 Surface mounting an electronic component
53 5,062,802 Contact module for a low height multi-chip carrier socket
54 5,061,827 Termination of a small coaxial cable
55 5,059,143 Connector contact
56 5,047,830 Field emitter array integrated circuit chip interconnection
57 5,019,892 Chip carrier with accumulator
58 5,015,191 Flat IC chip connector
59 5,007,845 Low height chip carrier socket
60 4,995,817 Electrical contact
61 4,995,816 Pivotal electrical contact
62 4,984,997 Locking clip for use with a chip carrier socket
63 4,969,826 High density connector for an IC chip carrier
64 4,968,259 High density chip carrier socket
65 4,959,029 Electrical contact
66 4,957,800 Method of constructing a monolithic block having an internal geometry and the block resulting there from
67 4,941,832 Low profile chip carrier socket
68 RE33,268 Chip carrier socket having improved contact terminals
69 4,934,173 Stamping and forming machine having toggles for reciprocating the tooling assemblies
70 4,927,369 Electrical connector for high density usage
71 4,918,571 Chip carrier with energy storage means
72 4,917,623 Terminator of a multi-strand electrical conductor
73 4,906,194 High density connector for an IC chip carrier
74 4,900,258 Multi-port coaxial printed circuit board connector
75 4,895,522 Printed circuit board coaxial connector
76 4,895,521 Multi-port coaxial connector assembly
77 4,884,484 Strip retainer and stripper for stamping and forming machine
78 4,880,386 Socketing a semiconductor device
79 4,873,615 Semiconductor chip carrier system
80 4,836,791 High density coax connector
81 4,832,612 Protective carrier and securing means therefore
82 4,819,476 Tooling for forming machines having improved guidance, tool mounting, and pilot pin systems
83 4,810,616 Manufacturing method for integrated circuit chip carriers
84 4,809,576 Scrap removal system for stamping and forming machine and sensor apparatus for detecting movement between conveyor belts
85 4,773,157 Method of making an electrical termination
86 4,747,483 Protective chip carrier handler
87 4,744,769 Closed loop connector
88 4,744,009 Protective carrier and securing means therefore
89 4,743,203 Camming means for use with a low insertion force connector
90 4,741,591 Optical fiber connector
91 4,737,120 Electrical connector with low insertion force and overstress protection
92 4,703,920 Manufacturing method for integrated circuit chip carriers and work holder for use in the method
93 4,699,593 Connector having contact modules for a substrate such as an IC chip carrier
94 4,695,111 Zero insertion force connector having wiping action
95 4,687,278 Contact socket with improved contact force
96 4,684,184 Chip carrier and carrier socket for closely spaced contacts
97 4,679,319 Tool and method for removing connector housings from terminals mounted on a substrate
98 4,653,840 Electrical connections for shielded coaxial conductors
99 4,645,296 Optical fiber connector apparatus and method of manufacture
100 4,645,279 Chip carrier socket having improved contact terminals
101 4,642,889 Compliant interconnection and method therefore
102 4,642,872 Terminal feeding and insertion device
103 4,637,135 Method for mounting a connector to a substrate
104 4,630,875 Chip carrier socket which requires low insertion force for the chip carrier
105 4,623,220 Laser to fiber connection
106 4,606,594 ZIF connector with wipe
107 4,602,833 Closed loop connector
108 4,587,548 Lead frame with fusible links
109 4,560,826 Hermetically sealed chip carrier
110 4,550,959 Surface mountable coefficient of expansion matching connector
111 4,513,353 Connection of leadless integrated circuit package to a circuit board
112 4,511,197 High density contact assembly
113 4,497,196 Apparatus for performing operations on strip material
114 4,489,871 Strip feeding apparatus
115 4,486,061 Zero insertion force connector having improved substrate clamp
116 4,469,389 Rotatable cam actuated connector for circuit board edge
117 4,461,522 Zero insertion force connector for a circuit board
118 4,451,818 Miniature connector for a circuit board edge
119 4,449,770 Socketless separable connector
120 4,445,271 Ceramic chip carrier with removable lead frame support and perforated ground pad
121 4,426,769 Moisture getter for integrated circuit packages
122 4,419,818 Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure
123 4,417,266 Power and ground plane structure for chip carrier
124 4,410,906 Very high speed large system integration chip package and structure
125 4,410,905 Power, ground and decoupling structure for chip carriers
126 4,408,815 High compliance roll-in channel wire termination
127 4,408,218 Ceramic chip carrier with lead frame having removable rim
128 4,402,561 Socket for integrated circuit package with extended leads
129 4,370,017 Complanate contact terminal
130 4,370,012 Electrical connector for circuit board or substrate
131 4,362,902 Ceramic chip carrier
132 4,354,729 Preloaded electrical contact terminal
133 4,268,102 Low impedance electrical connecting means for spaced-apart conductors
134 4,195,193 Lead frame and chip carrier housing
135 4,142,287 Electrical devices such as watches and method of construction thereof
136 4,116,519 Electrical connections for chip carriers
137 4,089,575 Connector for connecting a circuit element to the surface of a substrate
138 4,079,511 Method for packaging hermetically sealed integrated circuit chips on lead frames

Grabbe was born on 23 July 1927 at Karlowitz. He married Xenia von Leuchtenburg, daughter of Constantine von Leuchtenburg and Daria Obolensky, on 12 July 1950. RIN: 8915 PREFIX: Count 308915.
Xenia von Leuchtenburg was born on 20 May 1930 at Traunstein. She was the daughter of Constantine von Leuchtenburg and Daria Obolensky. She married Dimitri Grabbe on 12 July 1950. RIN: 8914 PREFIX: Duchess 308914.
Children of Xenia von Leuchtenburg and Dimitri Grabbe
Michael Grabbe   (07 Mar 1951)
Nina Grabbe   (17 Oct 1952)
Paul Grabbe   (07 Mar 1956)
Alexis Grabbe   (Mar 1960)
Xenia Grabbe   (16 Feb 1963)
Olga Grabbe   (07 Jul 1965)
Maria Grabbe   (07 Jul 1965)
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